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经营范围
发明名称
SOLDER PLATING METHOD
摘要
申请公布号
JPH02243791(A)
申请公布日期
1990.09.27
申请号
JP19890062783
申请日期
1989.03.15
申请人
HITACHI CABLE LTD
发明人
OTAKA TATSUYA;YOSHIOKA OSAMU;SHIMAZAKI HIRONORI
分类号
C25D5/18;H01L23/50
主分类号
C25D5/18
代理机构
代理人
主权项
地址
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