发明名称 METHOD MANUFACTURING A SEMICONDUCTOR DEVICE
摘要 <p>Semiconductor device is prepd. by chemical vapour deposition of amorphous Si on a substrate by a method in which the substrate e.g. of glass is coated in an atmos. of SiH4 at high freq. of less than 1 MHz, pref. 30-500 KHz, partic. 200 KHz under a pressure of 1 torr and power of 100 mW/cm2. The supply of SiH4 is stopped after a predetermined thickness, generally 1 mu, has been produced and O2 is supplied to form a plasma, with a wave of 30 KHz to 13.56 MHz, irradiating the deposit for a period of 30-40 minutes.</p>
申请公布号 KR900007050(B1) 申请公布日期 1990.09.27
申请号 KR19870007780 申请日期 1987.07.18
申请人 FUJITSU CO. LTD. 发明人 DAKASAKI GANEDOKE
分类号 C23C16/24;C23C16/509;H01L21/205;H01L31/18;H01L31/20;(IPC1-7):H01L31/042 主分类号 C23C16/24
代理机构 代理人
主权项
地址