METHOD OF PROVIDING RAISED ELECTRICAL CONTACTS ON ELECTRONIC MICROCIRCUITS

摘要

The mechanism applies " contact bumps" to a conductive layer (2) on a semiconductor substrate (1). A wire (5) made of a conductive material with a low melting point is fed through a capillary tube (4) in a heated nozzle (3). When a ball (6) has been formed on the end of the wire, the nozzle is lowered until the ball is squashed out to form a round flat "bump". When the bump has cooled slightly, the nozzle is raised by a distance equal to two or three times the wire diameter and moved 1.5 to 2 times the wire diameter to the side, causing a "kink" in the wire. The nozzle is then lowered to press the kinked portion of the wire into the bump. The nozzle is then raised and the wire breaks off. The temperature and nozzle movements are controlled by a microprocessor.