发明名称 |
METHOD FOR SIMULTANEOUSLY MACHINING BOTH SIDES OF DISC-SHAPED WORK PIECES, ESPECIALLY SEMICONDUCTOR WAFERS |
摘要 |
<p>A process is provided for bilateral abrasive machining of wafer-like workpieces, especially semiconductor wafers. The process uses carrier disks in which the outer periphery on which the driving forces mesh, is made of a material having a tensile strength of at least 100 N/mm2, while in the area that comes into contact with the workpieces to be machined, there is provided a plastic material having an elasticity modulus of from 1.0 to 8.104 N/mm2.</p> |
申请公布号 |
EP0208315(B1) |
申请公布日期 |
1990.09.26 |
申请号 |
EP19860109420 |
申请日期 |
1986.07.10 |
申请人 |
WACKER-CHEMITRONIC GESELLSCHAFT FUER ELEKTRONIK-GRUNDSTOFFE MBH |
发明人 |
BREHM, GERHARD, DR. DIPL.-ING. (TU);HALLER, INGO;ROTHENAICHER, OTTO, DIPL.-ING. (FH);LANGSDORF, KARL-HEINZ, ING. GRAD. |
分类号 |
B24B37/08 |
主分类号 |
B24B37/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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