| 摘要 |
A multilayer ceramic package comprising laminations of a glass-ceramic material, the preferred example of which is an MgO-Al2O3-SiO2 ceramic. A ceramic structure comprising a heatsink layer and a ceramic layer made of a glass-ceramic material is assembled in an unfired state and this structure is then fired. Conductor patterns can be screen printed on the unsintered glass ceramic layer, using gold or copper metallisation pastes, permitting the whole assembly to be fired in a single operation. |
