| 摘要 |
PURPOSE:To perform three-dimensional hole machining with high accuracy without cracking by setting specifically the irradiation energy and irradiation time of a laser beam, performing two-dimensional groovelike machining and then, bringing fine ceramics close to the direction of beam irradiation to perform machining. CONSTITUTION:At the time of performing three-dimensional hole machining on the fine ceramics, in order to reduce cracking generated by thermal stress at each point of a machining part, the amount of heat charged on each point by the laser beam 2, the beam diameter and the beam irradiation time are first set so that the machining hole diameter and the machining depth are made to 50 - 500mum and 50 - 100mum, respectively in the range where cracking is not caused which is obtained from an experimental value of a material 10 to be machined. The laser beam 2 and the fine ceramics are moved relatively by 0.05 - 0.9 times of the machining hole diameter in parallel with the surface to be machined to perform two-dimensional groovelike machining. Continuously, the fine ceramics is brought close to the direction of beam irradiation by 0.7 - 1.3 times of the set machining depth to perform machining. The machining is repeated successively to perform hole machining. |
