| 摘要 |
PURPOSE:To prevent the displacement of an electrode and the occurrence of a thin burr on a terminal face by a method wherein the projecting electrode is provided on the surface of a support part, an integrated circuit element is bonded on the electrode and sealed with resin and then the reverse side of the support part is removed until the electrode is exposed. CONSTITUTION:One surface of an iron metal thin plate is half-etched and thereby a lead frame 1 provided with a projecting electrode 1a and a flat-plate-shaped electrode support part 1b is prepared. Next, an insulative bonding agent 3 is applied to a prescribed position on the electrode 1a, an integrated circuit element 2 is mounted by die-bonding and the prescribed electrode 1a and an input-output terminal of the integrated circuit element 2 are connected by a gold slender wire 4. In succession, the other surface 1e of the support part 1b is brought into contact with a bottom tool of a transfer mold and epoxy sealing resin 5 is injected to seal up the integrated circuit element 2, the gold slender wire 4, etc., with the resin. Thereafter the other surface 1e of the support part 1b is ground by a surface grinding machine, the electrode support part 1b is removed thereby and the electrode 1a is separated and exposed, so that a terminal face 1x for external connection by prepared. By this method, the displacement of the electrode and the occurrence of thin burrs are prevented. |
