发明名称 Polymide for high-temperature adhesive
摘要 This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application. The polyimide has recurring units of the formula <IMAGE> +TR <IMAGE> (where the positions of two carbonyl radicals in a benzene ring are meta or para, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function). The polyimide can be prepared by reacting diamine with tetracarboxylic dianhydride in organic solvents and imidizing resultant polyamic acid. The diamine in use is ether diamine and includes 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene and 1,4-bis[4-(3-aminophenoxy)benzoyl]benzene. Various tetracarboxylic dianhydrides can be used and particularly prefered are pyromellitic dianhydride and 3,3',4,4'-benzophenonetetracarboxylic dianhydride.
申请公布号 US4959440(A) 申请公布日期 1990.09.25
申请号 US19870006513 申请日期 1987.01.23
申请人 MITSUI TOATSU CHEMICALS, INC. 发明人 TAMAI, SHOJI;KAWASHIMA, SABURO;SONOBE, YOSHIHO;OHTA, MASAHIRO;OIKAWA, HIDEAKI;YAMAGUCHI, AKIHIRO
分类号 C08G73/00;C08G73/10;C09J179/08 主分类号 C08G73/00
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