| 发明名称 |
Lead connection structure |
| 摘要 |
Lead connection in a structure is provided by leads disposed against electrodes of wiring board through resin, which resin is then stiffened by the application of light. Accordingly, an electrical and a mechanical connection of the leads and the electrondes is accomplished.
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| 申请公布号 |
US4959590(A) |
申请公布日期 |
1990.09.25 |
| 申请号 |
US19860943198 |
申请日期 |
1986.12.18 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HATADA, KENZO;NAGAO, KOICHI |
| 分类号 |
H01L21/00;H05K3/28;H05K3/36 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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