Printed circuit board

摘要

In a printed circuit board having a glass substrate, signal line conductors having uniform resistances are formed of a thin film of ITO or SnO2 alone, while a power supply conductor whose voltage drop is small is formed of a film of ITO or SnO2, a film of Ni plating, a film of Au plating and a thick film of metal formed of plating or paste. Bonding pads are formed of a thin film of ITO or SnO2, a film of Ni plating and a film of Au plating.