| 摘要 |
PURPOSE: To provide a method for high-density interconnections among multiple pads, formed on a plurality of circuit boards. CONSTITUTION: A housing 12 is built by combining covers 30, 38 with a frame 14, having slots 22, 26 via hinges 36, 38. Elastomer members 46, 54, on the surface of which conductive elements are formed, are inserted into the slots 22, 26, respectively. After circuit boards 60, 67 with pads 74 are placed on the upside and the downside of the frame 14, respectively, and each of the covers 30, 38 is folded onto the corresponding outside surface of the circuit boards 60, 67, is fastened and fixed, together with fixing members 76, 78, 80, 82. |
