| 摘要 |
<p>PURPOSE:To provide a contact unit, for a handler, wherein it can comply easily with various kinds of semiconductor devices. CONSTITUTION:In a contact unit 1, a measuring probe 16 for a socket 15 is brought into contact with a lead 11 for a semiconductor device. In the contact unit, a holding mechanism 2 which is composed of a suction nozzle 22 for the semiconductor device 10 and of a holding plate 21 is installed at the lower side of a conveyance plate 5, a coupling mechanism 3 which is composed of a pressure plate 32 installed at the upper-side of the conveyance plate 5 and of a coupling rod 33 is installed, and the holding mechanism 2 is held so as to be movable up and down. In addition, the shaft 42a of a ball screw 42 which is moved up and down by the drive of a pulse motor 41 is installed at the upper part of the coupling mechanism 3, and a pressure mechanism 4 which moves the coupling mechanism 3 up and down is installed.</p> |
