发明名称 COMPOSITE MOLDING FILLED WITH SPECIAL EPOXY RESIN COMPOSITION
摘要 <p>PURPOSE: To prevent the stress cracks of a thermoplastic die by an epoxy resin filler and heat cycle cracks of the epoxy resin filler itself from developing by including specific polyglycol diepoxide into an epoxy resin composition at a specific ratio and increasing the impact strength of the filler and a final composite. CONSTITUTION: A thermoplastic shell die may be formed of either of various thermoplastic materials containing a polyester material, polysulfone, polyesterimide or the like. A heat-curable resin composition is provided which is substantially composed of an epoxy resin composition of 25-75% of 1.2-epoxy resin having at least, two pieces of epoxy group per molecule and 75-25% of polyglycol diepoxide having a viscosity of 2000-5000 cps, a small but effective amount of phenol promoter and a curing catalyst. Further, as an additional component for enhancing the fluidity by adjusting the viscosity, the glycidyl ether of aliphatic alcohol with 8-14 carbon atoms per molecule may be included into the resin composition.</p>
申请公布号 JPH02238909(A) 申请公布日期 1990.09.21
申请号 JP19900013783 申请日期 1990.01.25
申请人 GENERAL ELECTRIC CO <GE> 发明人 TOROSHIAN KEBOOKU ARA;MAAKOBIITSUZU MAAKU;KOTSUKUSU FUREDERITSUKU YUUJIN
分类号 B29C39/02;B29K63/00;B29L31/34;B32B1/00;B32B27/08;C08G59/00;C08G59/20;C08G59/22;C08G59/38;C08G59/68;C08L63/00;H01B3/40;H01B17/60 主分类号 B29C39/02
代理机构 代理人
主权项
地址