| 摘要 |
<p>PURPOSE:To provide a pressure-sensitive adhesive sheet which is suitable for use in sticking semiconductor wafers and whose adhesion is variable, by forming a layer of a radiation-curable, pressure-sensitive adhesive consisting of a pressure- sensitive adhesive and a radiation-polymerizable oligomer on a substrate. CONSTITUTION:10-90pts.wt. acrylic pressure-sensitive adhesive is mixed with 90-10pts.wt. radiation-polymerizable urethane acrylate oligomer to prepare a radiation-curable, pressure-sensitive adhesive. A layer 2 of the adhesive is formed on a substrae 1 to obtain the desired pressure-sensitive adhesive sheet A. In the use of the sheet A, the sheet is placed in such a manner that the upper side is the adhesive layer 2. A semiconductor wafer B to be processed is sticked on the adhesive layer and is processed. The layer 2 is irradiated with a radiation 4 to polymerize and cure the radiation-polymerizable oligomer, whereby the adhesion of the adhesive layer 2 is reduced, and wafer chips b are picked up.</p> |
