发明名称 MANUFACTURING DEVICE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent development of many scraps of silicon which attach onto a semiconductor element and cause defective connection and contact by recognizing a location deviation amount of a semiconductor element by a picture and by providing a recognition control means which gives a driving instruction to a re-positioning stage based on the deviation amount. CONSTITUTION:A semiconductor element 1 is arranged on a table 2. After a position of the element is automatically detected and recognized with a camera 3 for a table, positioning of the element 1 is carried out. A transfer arm 4 seals the element 1 and locates it to a re-positioning stage 5. A location deviation amount of the element 1 against a sealed section thereof is automatically detected with a camera 6a for a re-positioning stage. A control section 6b gives a movement amount to the stage 5 based on the detected signal corresponding to an amount of location deviation. A recognition control means to give a location deviation correcting instruction to the stage 5 is composed of the camera 6a, the control section 6b, etc. The stage 5 moves in a rotating direction, right and left to correct a location deviation of the semiconductor element 1. Thereby, silicon scraps do not develop and defective connection and contact can be eliminated.
申请公布号 JPH02239637(A) 申请公布日期 1990.09.21
申请号 JP19890061580 申请日期 1989.03.14
申请人 NEC CORP 发明人 ITO KATSUSHI
分类号 H01L21/52 主分类号 H01L21/52
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