| 摘要 |
PURPOSE:To prevent a pad on wire bonding from being damaged due to sinking, etc., of a hard printed-circuit board. CONSTITUTION:When load from a capillary 01 is directly applied to a hard printed-circuit board 2, the root of a sinking pad of the printed-circuit board 2 is cut. A copper-plated film 14 and a gold-plated film 16 are laminated on a copper foil 6 of individual wiring to constitute a thick pad 12, thus scattering force from the capillary 01. Also, the section of the pad 12 is in trapezoid shape, thus absorbing force from the capillary 01 due to the deformation of the pad 12. |
