发明名称 LIQUID ADHESIVE FOR ELECTRONIC COMPONENT AND METHOD OF FORMING INSULATING ADHESIVE LAYER USING THE SAME
摘要 PURPOSE:To obtain adhesive which can keep adhesiveness and can be cured under a relatively low temperature and has sufficient heat-resistance properties and reliability by a method wherein a specific compound which has at least two maleimide groups is dispersed with a specific ratio in solution which is obtained by dissolving specific butadiene-acrylonitrile copolymer in organic solvent. CONSTITUTION:Butadiene-acrylonitrile copolymer which is expressed by a formula I or a formula II, contains piperazinylethylaminocarbonyl group has a weight- average molecular weight of 1000-200000, contains 5-50wt.% acrylonitrile and has an amino group equivalent of 500-10000 is dissolved to obtain solution (a). A compound (b) which contains at least two maleimide groups and is selected among compounds expressed by formulae III-VI is dispersed in the solution (a) so as to have 10-900wt. parts of the component (b) for 100wt. parts of the component (a). In the formula I and formula II, (k), (m) and (n) denote in mole ratios and, when n=1, (k) and (m) are in ranges that k=3-175 and m=0.3-93.
申请公布号 JPH07130772(A) 申请公布日期 1995.05.19
申请号 JP19930292474 申请日期 1993.10.29
申请人 TOMOEGAWA PAPER CO LTD 发明人 SHIMA TAKESHI;NAKABA KATSUJI;KOBAYASHI MASAHARU;SAKUMOTO YUKINORI
分类号 C09J109/02;C09J4/06;C09J115/00;C09J121/00;H01L21/52;H01L23/495;H01L23/50 主分类号 C09J109/02
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