| 摘要 |
<p>PURPOSE:To improve the packaging density by boring holes large enough to form capacitors in a ceramic green sheet, filling said holes with dielectric paste, laminating ceramic green sheets on which electrodes are printed on both faces of the ceramic green sheet, and firing said sheets integratedly to form the capacitors. CONSTITUTION:A ceramic green sheet 1, in which holes large enough to form capacitors are bored, is mounted on a peeling film 7 and the bored hole parts are filled with dielectric 3 paste 8. After drying, the sheet 1, having holes filled with the dielectric 8, is peeled off the peeling film 7 and placed, laminated, and adhered by thermocompression bonding between a pair of ceramic green sheets 4 and 9, having electrodes 5 printed beforehand thereon and in the through holes 6 therein, and said ceramic sheets are fired integratedly to form capacitors. A circuit substrate including the capacitors thus formed has flat surfaces to hardly cause peeling between the dielectric layer and the electrodes and between the dielectric layer and the insulating layer.</p> |
