| 摘要 |
The wafer for forming an integrated circuit of it comprises a circular contour portion, one flat portion for defining a crystal orientation, and connecting portions, disposed between the circular contour portion of the wafer and respective ends of the flat portion. The connecting portions are chamfered in a thickness direction and in a plane parallel to a major surface thereof to form curvilinear contours so as to prevent a chipping of the wafer at the connecting portion during a processing. The wafer is of a single crystal. |
