| 摘要 |
<p>PURPOSE:To promote high-density mounting while improving performance by joining a dielectric film consisting of a metal oxide film, a resistor film consisting of a metal thin film and a laminated sheet consisting of a metal conductor layer at least to one side of an insulating base material made of synthetic resin. CONSTITUTION:An insulating base material 17 made of synthetic resin and having heat resistance and a laminated sheet 10 to join at least to one side of the same base material 17 for being integrated are provided. Then, the laminated sheet 10 is composed of a dielectric film 12 consisting of a metal oxide film, a resistor film 13 consisting of a metal thin film laminated on the dielectric film 12 and a pair of metal conductor layer 11 formed in the position putting both of the dielectric film 12 and the resistor film 13 between. Thereby, mounting density of electronic parts can be more improved with relatively simple constitution, moreover a stable characteristic inside a circuit can be excellently exhibited while contributing to improve reliability.</p> |
