| 摘要 |
<p>PURPOSE:To reduce a transmission loss and to enhance a high-frequency characteristic by a method wherein a glass-ceramic composite material is used instead of alumina, copper is used for a conductive line, a part in a substrate used to mount a semiconductor chip is formed as a recessed part and the semiconductor chip is mounted on an aluminum nitride substrate. CONSTITUTION:A composite material of borosilicate glass and alumina is used as a dielectric; Cu is used as a conductor line; a glass-ceramic green sheet 8 in which a mounting hole 7 of a semiconductor chip is formed in the central part is piled; this assembly is bonded to an AlN substrate 9. The laminated green sheet 8 is bonded to the AlN substrate 9 in an inert atmosphere in order to prevent the Cu from being oxidized; when glass of the green sheet is bonded as a binder, a baking operation is executed by placing a weight of a proper amount. Thereby, a ceramic circuit board whose signal propagation delay is small, whose transmission loss is small, whose heat-dissipating property is good and whose conductor line resistance is low can be obtained as a ceramic circuit board on which the semiconductor chip is mounted in optical communications.</p> |
