| 摘要 |
<p>PURPOSE:To prevent interfacial peeling, etc., of a cable by providing an edge cut section to an inside edge section of an external semiconducting layer with a crosslinking agent composed of an organic peroxide higher in half-life temperature than that of a mold resin insulator. CONSTITUTION:Semiconductive tape is wound around the connecting part to which conductors are connected with a sleeve 3. It is heated and melted for crosslinkage to form a semiconducting layer 4. An insulator 6 is formed by winding over this part with unbridged cross linking material-contained component tape. On the inside circumference of it semiconducting tape is wound around to form bisected external semiconducting layers 7 and 8. Here, the edge section 7a of the external semiconducting layer 7 is put inside, over which the edge section 8a of the other external semiconducting layer 8 is overlapped in wrap by interposing filler resin to form an edge cut section 10. For the filler resin a compound of an organic peroxide higher in half-life temperature than the resin forming the insulator 6 is used, over which pressure tape 11 is wound and is heated and cross linked by setting a metal mold.</p> |
