Device having a thermally releasable bond between two parts of different expansion behaviour

摘要

The device (2) includes a thermally releasable bond between two parts (5, 8) of different expansion behaviour. For releasing the bond, a heating apparatus (16) may be provided. At an assembly temperature (Tm), above an operating temperature (Tb), a small assembly gap (11) is formed between the parts to be bonded. According to the invention, an inner part (5) of good thermal conductivity is to be arranged around a supporting element (6) of a low thermal coefficient of expansion ( alpha 1) and thermally bonded to an object to be brought to the operating temperature (Tb). An outer part (8) of good thermal conductivity and a significantly greater coefficient of expansion ( alpha 2), to be cooled to the operating temperature (Tb) by means of a corresponding apparatus (4), is to be provided with a recess (9) of such a shape that at the assembly temperature (Tm) it can be arranged so as to surround the inner part (5) while forming the assembly gap (11). The outer part (8) is also to include the heating apparatus (16). <IMAGE>