| 摘要 |
<p>A high circuit density printed circuit board is manufactured on a metal substrate by building a layer of photoimageable dielectric on the metal substrate and then imaging the dielectric in a manner so as to create wells for active components which are mounted directly on the metal substrate for the purpose of heat dissipation. The build up of the dielectric layer can be improved to provide circuit traces such as, for example, buried coaxial cables prior to the imaging process to achieve even higher density with conventional circuit boards.</p> |
