| 摘要 |
<p>PURPOSE:To make it possible to bond easily a group of leads to the electrodes of a semiconductor element without using a solder or the like by a method wherein the group of leads, which are bonded to electrodes on an insulating substrate, such as a display panel or the like, are directly bonded to the electrodes of the semiconductor element in an opening part, from which a flexible resin film is removed, of substrate. CONSTITUTION:In a substrate 19, Cu foil patterns 21 and 21' subjected to Sn plating treatment are adhered on a flexible resin film 20 consisting of a polyimide or the like and an opening part 22 is formed in a region, where a semiconductor element 1 is connected, of the film 20. The leads 21 and 21' of a wiring pattern consisting of a Cu foil are made to protrude in the opening part 22 and are extendedly provided, one end of the lead 21 is bonded to an electrode of the element 1 and the other end is extendedly provided continuously to the region of an electrode 12 of a display panel 10. An opening part 24 is formed in the film 20 at a region, where the lead 21 is bonded to the electrode 12, of the panel 10, the lead 21 only is extendedly provided to the part 24 and part of a flexible resin film 20' is remained on the lead 21 at the final end of the lead 21. Thereby, a group of the leads 21 can be easily connected to electrodes of the element 1 without using solder or the like.</p> |
