| 摘要 |
PURPOSE:To enable the normal operation of a circuit regardless of increase of peripheral circuits by providing one bonding pad in a circumferential part of a chip and at least one bonding pad an inside part of the chip and connecting each bonding pad to the same external lead-out lead by a metal wire respectively. CONSTITUTION:Bonding pad 4 is arranged in the circumferential part of a semiconductor chip 10 and is connected to an external lead-out lead 5 by a metal wire 6. For one signal wire, one bonding pad 4' in the circumferential part of the chip and at least one bonding pad 4'' the inside part of the chip are arranged with interposing other signal wires 1, 2 and 3. And the bonding pads 4' and 4'' are connected to the same external lead-out lead 5' by metal wires 6' and 6'' respectively. At least one set of such bonding pads is provided. Consequently, it becomes unnecessary to provide the wiring of polysilicon between the bonding pad 4'' and the bonding pad 4' in the circumferential part thereby reducing the wiring resistance. |
