发明名称 Chemical vapor deposition method.
摘要 <p>A CVD method comprises the steps of making a plasma self-cleaning within a chamber (2) using a gas which includes fluorine, coating an inside of the chamber by a first layer of a material which includes silicon and nitrogen, and forming a second layer on a predetermined surface within the chamber by a chemical vapor deposition. The second layer is made of a material which includes a quantity of nitrogen smaller than a quantity of nitrogen included in the first layer.</p>
申请公布号 EP0387656(A1) 申请公布日期 1990.09.19
申请号 EP19900104203 申请日期 1990.03.05
申请人 FUJITSU LIMITED 发明人 TSUKUNE, ATSUHIRO;KOYAMA, KENJI
分类号 C23C16/44;C23C16/30;C23C16/50;H01L21/205;H01L21/302;H01L21/3065;H01L21/31 主分类号 C23C16/44
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