发明名称 |
Chemical vapor deposition method. |
摘要 |
<p>A CVD method comprises the steps of making a plasma self-cleaning within a chamber (2) using a gas which includes fluorine, coating an inside of the chamber by a first layer of a material which includes silicon and nitrogen, and forming a second layer on a predetermined surface within the chamber by a chemical vapor deposition. The second layer is made of a material which includes a quantity of nitrogen smaller than a quantity of nitrogen included in the first layer.</p> |
申请公布号 |
EP0387656(A1) |
申请公布日期 |
1990.09.19 |
申请号 |
EP19900104203 |
申请日期 |
1990.03.05 |
申请人 |
FUJITSU LIMITED |
发明人 |
TSUKUNE, ATSUHIRO;KOYAMA, KENJI |
分类号 |
C23C16/44;C23C16/30;C23C16/50;H01L21/205;H01L21/302;H01L21/3065;H01L21/31 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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