| 发明名称 |
Liquid epoxy polymer composition and use thereof. |
| 摘要 |
<p>A liquid epoxy composition containing a diglycidyl ether of a dihydric phenol and/or a diglycidyl ether of a tetrabrominated dihydric phenol, an epoxy with a functionality from 2.2 to 4, cycloaliphatic diamine curing agent, and thixotropic agent; and use thereof to fill drilled through-holes in circuit boards and cards and as isolation border around the edges of a board or card.</p> |
| 申请公布号 |
EP0387554(A2) |
申请公布日期 |
1990.09.19 |
| 申请号 |
EP19900103374 |
申请日期 |
1990.02.22 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
WANG, DAVID WEI |
| 分类号 |
C08L63/00;C08G59/00;C08G59/06;C08G59/08;C08G59/20;C08G59/24;C08G59/38;C08G59/50;H01L23/29;H01L23/31;H05K3/00;H05K3/22;H05K3/28 |
主分类号 |
C08L63/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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