Chip carrier with improved flexing characteristic.

摘要

A flexible film chip carrier including a plurality of groups of metal wires (3) formed on the surface of an electrically insulating flexible film member (2). The flexible film member is formed with a plurality of predetermined flexion parts in portions thereof which are in superposition relation with the metal wires, and the flexible film member is partly or wholly reduced in thickness in areas thereof each containing one of the predetermined flexion parts and its surroundings as compared with the remaining portion thereof. Each of the thin-section parts is in the form of a slit along the predetermined flexion part and the chip carrier is bendable at these thin-section parts.