| 摘要 |
PURPOSE:To reduce stress generating in a semiconductor element, and improve heat dissipation by forming an island part of material whose linear expansion coefficient is small, and forming a lead part of material whose thermal conductivity is large. CONSTITUTION:A plate type clad material wherein iron based alloy like 42 alloy and copper based alloy like phosphor bronze are stacked and made composite, is etched. An island part 1 and a retaining arm 5 are formed of iron based alloy 10. A lead part 2 and a tie bar 4 are formed of copper based alloy 11. A frame 3 is formed by stacking the alloy 10 and the alloy 11 as intact. By this constitution, the linear expansion coefficient of the island part 1 becomes approximate to that of the semiconductor element, so that the stress generating in the element is reduced. The thermal conductivity of the lead part 2 is large, so that heat dissipation is improved. |
