| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate lift and dislocation of circuit constructing elements and still to prevent conduction failure between lands, by providing a groove as a solder reservoir in a circuit constructing element mounting part on the printed wiring board. SOLUTION: A chip capacitor 1 is mounted so that electrodes thereof are partly on grooves 5 provided on the lands 3 of an electronic circuit board 2 with printed wiring, and a definite amount of solder paste 6 is spread on the printed wiring pattern on the electronic circuit board 2 and is heated in a reflow furnace to join the chip capacitor 1 and the electronic circuit board 2. Thus, electrical and mechanical junction is assured, and further the occurrence of lift or rise of a circuit constructing element can be prevented and sure positioning can be achieved. Accordingly, the time and the man-days for solder modification, conventionally carried out by manual operation, can be reduced, and the production efficiency can be improved.</p> |
