| 摘要 |
<p>PURPOSE:To enhance the performance of an optical coupling element by bonding light transmission and high withstand voltage film of glass or region between a light emitting element and a photodetector in a photocoupler at both sides, thereby reducing the interval between both elements and the loss of the input light, thereby increasing the insulating withstand voltage. CONSTITUTION:A light transmission high withstand insulating layer 9 is coated with resin such as PIQ or is formed by an electrophoresis with a glass insulating layer on the surface of a wafer. Aluminum is evaporated in vacuum to cover the aluminum film on the overall surface of the wafer covered with the layer 9. This pattern is formed, with a photoresist as a mask the unnecessary part of the aluminum film is removed by chemical etching. The layer 9 is selectively etched similarly to the patterning of the aluminum film. The wafer formed with the surface film and the wiring conductor is divided into pellets. The pellets of the photodetectors produced on the lead wires 10 are die bonded, and a light emitting element 11 is die bonded further thereon. The entirety is molded with transparent resin, and in order to further remove the influence of the external light, light shielding resin is molded.</p> |
