发明名称 MANUFACTURE OF COPPER PLATE-CONTAINING MULTILAYERED PRINTED BOARD
摘要 PURPOSE:To make uniform the thickness of a copper plate by controlling the flowing-out of resin to the outside in laminating a prepreg by providing a resistance part against a resin flow on the outer circumference of the copper plate. CONSTITUTION:A relief hole 11 is provided in a copper plate 1 at a necessary portion of the same, and resistance part 2 against a resin flow is formed on the circumferential part of the copper plate. The resistance part 2 is configured into a shape having protruded stripe 21 formed on the circumference of the copper plate 1, or in a shape where many 1-2mm horn-shaped protruded part 22 is formed on the circumference of the copper plate 1 and has roughness on the surface of that part, or into a shape where mesh-shaped protruded part 23 is formed on the circumference of the copper plate 1. Hereby, a resin flow is prevented from flowing out in laminating a prepreg 3 to make uniform the thickness of the copper plate.
申请公布号 JPH02234494(A) 申请公布日期 1990.09.17
申请号 JP19890055757 申请日期 1989.03.07
申请人 FUJITSU LTD 发明人 FUJITA YUKIO;KODAMA TOSHIRO;SAKURAGI NOBUO;YAMASHITA MITSUO;MIYAZAWA HIDEMI
分类号 H05K3/46 主分类号 H05K3/46
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