METHOD AND APPARATUS FOR MOUNTING CHIP-SHAPED ELECTRONIC PARTS,申请号JP19890054806-传众专利搜索

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发明名称	METHOD AND APPARATUS FOR MOUNTING CHIP-SHAPED ELECTRONIC PARTS
摘要
申请公布号	JPH02234496(A)	申请公布日期	1990.09.17
申请号	JP19890054806	申请日期	1989.03.07
申请人	TAIYO YUDEN CO LTD	发明人	SEKI MASAKAZU;SEKI FUJIO
分类号	H05K13/02;B23P21/00	主分类号	H05K13/02
代理机构		代理人
主权项
地址

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