MANUFACTURE OF SEMICONDUCTOR ELEMENT LEAD FRAME,申请号JP19890054113-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	MANUFACTURE OF SEMICONDUCTOR ELEMENT LEAD FRAME
摘要
申请公布号	JPH02232958(A)	申请公布日期	1990.09.14
申请号	JP19890054113	申请日期	1989.03.07
申请人	DAINIPPON PRINTING CO LTD	发明人	YAGI YUTAKA
分类号	H01L23/50	主分类号	H01L23/50
代理机构		代理人
主权项
地址

您可能感兴趣的专利

ENCAPSULATED TYPE ELECTRIC COMPRESSOR

OVERHEAD CAM SHAFT FOR UNIT INJECTOR USE ONLY

CASING STRUCTURE OF ENGINE

AUTOMATIC ICE-MAKING DEVICE

CRACK SUPPRESSING METHOD FOR CONCRETE

PANEL JOINING STRUCTURE FOR ENVELOPE

ROOF STRUCTURE OF BUILDING AND ITS CONSTRUCTION METHOD

NEWSPRINT PAPER FOR OFFSET PRINTING

PULP BEATING FOR BASE PAPER OF PHOTOPRINT

ELECTRON BEAM VAPOR DEPOSITION APPARATUS

PRODUCTION OF HOT-DIP GALVANNEALED STEEL SHEET

DRAIN PIPING OF MULTI-LAYER BUILDING

CONCRETE PANEL AND CONCRETE STONE FOR WATER WAY

BARRICADE STAND

FALSE TWIST APPARATUS

DISPOSABLE PAPER BIB USING VINYL SMOCK

CASE HARDENING STEEL EXCELLENT IN LOW CYCLE FATIGUE STRENGTH