BOARD AND MANUFACTURE THEREOF

摘要

PURPOSE:To decrease total board thickness and to protect a connection part against breakage and disconnection by a method wherein an electronic element is arranged inside an opening formed on a board main body, and the connection terminals of the electronic element are fixed to corresponding conductive materials filled into corresponding through-holes. CONSTITUTION:Two or more through-holes 12 are provided to a base main body 10 nearly along the outline of an IC chip 20. The through-holes 12 are filled with conductive material 16. An opening 14 slightly larger than the chip 20 in size is formed on the base main body 10 through a pressing work. The through-holes 12 are cut off into semicylinders respectively and concurrently semicylindrical conductive materials 16 are formed. Wall faces 16a of two or more conductive materials 16 are formed separate from each other at a certain interval on the same plane to serve as parts of end faces 14a of the opening 14 respectively. Then, the IC chip 20 is press-fitted into the opening 20 keeping two or more leads 21 of the IC chip 20 in contact with the semicylindrical conductive materials 16 of the corresponding through-holes 12 respectively.