| 摘要 |
<p>PURPOSE:To obtain a semiconductor device with a high dielectric breakdown strength by mounting the semiconductor device on a lead frame whose mounting segment is retained only by a mounting segment suspension lead terminal, and covering these with sealing resin, excepting an output part of the lead terminal of the lead frame. CONSTITUTION:A semiconductor element 20 is mounted on the mounting segment 30 of a lead frame 21, which is set in a metal mold. When the lead frame 21 is set in the metal mold, the mounting segment 30 is retained by a positioning pin so as to enable positioning without the moving of the mounting segment 30 as the result of jetting sealing resin 22. After that, the sealing resin 22 is jetted out, and a semiconductor device is manufactured by lifting a positioning pin up to the surface of a molding object before the hardening of the resin 22. Since the mounting segment 30 is retained only by a mounting segment suspension lead terminal 29, sealing is enabled excepting an output part of the lead frame 21, without exposing the cut segment of a tie bar from sheath after resin sealing as in the conventional case.</p> |
