发明名称 |
VERFAHREN ZUR HERSTELLUNG VON GEDRUCKTEN SCHALTUNGSPLATTEN. |
摘要 |
A method of producing a printed circuit board comprising the steps of applying a layer of electrically conductive material on at least one side of a printed circuit board, cleaning the surface of the electrical conductive layer, printing a plating resist onto the layer so as to expose only the required trace area of an electrical circuit pattern, electroplating over the layer of electrically conductive material a layer of nickel metal which has a melting point sufficiently high to prevent movement in a molten state during a subsequent soldering operation, removing the plating resist by etching leaving a nickel layer on the trace areas of the circuit pattern, applying a solder resist to the layer so as to expose only the plated-through holes and other connecting sites of the board such as contact fingers and connecting pads, removing the nickel metal from the exposed area of the board, and applying a layer of sealant to retard copper oxidation and/or promote solderability of the exposed plated-through holes, the connecting pads and the contact fingers. |
申请公布号 |
DE3673359(D1) |
申请公布日期 |
1990.09.13 |
申请号 |
DE19863673359 |
申请日期 |
1986.06.02 |
申请人 |
NCR CORP., DAYTON, OHIO, US |
发明人 |
MITCHELL, E., CURT, CAMBRIDGE, OH 43725, US |
分类号 |
H05K1/11;H05K3/06;H05K3/10;H05K3/24;H05K3/28;H05K3/34;H05K3/38;H05K3/42;(IPC1-7):H05K3/34 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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