| 摘要 |
PURPOSE:To increase the adhesion between a copper circuit and resin by a method wherein the surface of the copper circuit is subjected to oxidation treatment, thereby roughening the surface. CONSTITUTION:The surface of a copper circuit board for an inner layer is subjected to oxidation treatment, which can be done by using, e.g. ammonium acetate system aqueous solution. A copper oxide layer can be formed on the surface of the copper circuit by oxidation treatment. After the oxide layer whose main component is Cu2O is formed on the surface of the copper circuit of the circuit board for an inner layer and dried, the surface of the copper circuit of the circuit board for an inner layer is subjected to acid treatment, and CuO component is eliminated from the copper oxide formed by acid treatment. By eliminating this CuO from the surface of the copper circuit, halo phenomenon generating in plating process can be prevented. |
