| 摘要 |
PURPOSE:To shorten the length of a line, to improve treating capability and to decrease cumbersome time and labor required for adjusting machining costs by providing a constitution wherein resin liquid which is picked up and supplied in contact with parts in synchronization with the parts is spread over the entire surface of each electronic part when the electronic part is preheated and turned, and an applied film having a specified thickness is formed. CONSTITUTION:An electronic part 7 is coupled into each hole 6 of a conveyer belt 5 and held in a horizontal posture. At the lower end of the conveying belt 5, a rail 9 wherein a plurality of grooves 8 are formed is provided. Metal caps 7b of the electronic part 7 are received and supported with the upper surfaces at both ends of each groove 8. A resin-liquid pickup and contact mechanism 3 is provided with a resin liquid tank 10 wherein the thermosetting resin liquid is stored and resin-liquid pickup nozzles 11 whose number is equal to the line number of the electronic parts 7. The resin liquid 13 which is picked up with each nozzle 11 is brought into contact with the electronic part 7. The resin liquid 13 which is attached to the main body of the electronic part 7 is expanded along the outer surface of the main body of the part by heating and turning and dried. Thus, the applied film having the specified thickness is formed. The pickup amount of the resin liquid is adequately adjusted, and the applied film having the specified thickness can be formed. The line iength of a packaging apparatus can be shortened to a large extent. |
