发明名称 LED ARRAY HEAD
摘要 PURPOSE:To obtain an LED array head which can be easily manufactured at low cost by a method wherein a wiring containing a pattern extending from one side to the opposite side and a pattern existing only on the one side in the same layer 1 is formed by insulating it from a LED array with an insulating layer on a plane, and the LED array is connected to a driving circuit via the wiring. CONSTITUTION:Among wirings 14, 16, 8 on a first layer formed directly on a substrate 2, the wiring 14 is the wiring for connecting a LED array 4 to a driving circuit IC 6 and is patternized. An insulating material layer 20 is formed on the wiring 14 excepting its both ends, and a second layer wiring 22 is formed on said insulating material layer 20. The wiring 14 contains a wiring 14a extending from an one side on which the driving circuit IC 6 is arranged to an opposite side of the LED array 4, and a wiring 14b existing only on the one side of the LED array 4. A space between individual electrode terminals of the LED array 4 are connected with wires 28, 30. Spaces between terminals of the wiring 14a, 14b and a terminal of the driving circuit IC 6 are connected with a wire 32. Since a fine wiring pattern is only the first layer wiring 14, manufacture of a laminated substrate becomes easy, and substrate cost is reduced.
申请公布号 JPH02229057(A) 申请公布日期 1990.09.11
申请号 JP19890050298 申请日期 1989.03.01
申请人 RICOH CO LTD 发明人 AGARI HIRONOBU
分类号 B41J2/44;B41J2/45;B41J2/455;H01L33/08;H01L33/62 主分类号 B41J2/44
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