发明名称 |
Interconnection of electronic components |
摘要 |
A technique for interconnecting electronic components in which interconnection wires are bonded to contacts on a first component without the use of a material other than the materials of the contacts and the wires; the wires are then severed to a desired length of between 2d and 20d, where d is the diameter of the wires, and bonded to contacts on the second component by means of a conductive material such as solder. Preferably, solder is provided as pools located in recesses in a layer of insulting material. The wire may be bonded to the contact on the first component by means of a wire bonder having a bonding head which weakens or severs the wire to the desired length. |
申请公布号 |
US4955523(A) |
申请公布日期 |
1990.09.11 |
申请号 |
US19880151131 |
申请日期 |
1988.02.01 |
申请人 |
RAYCHEM CORPORATION |
发明人 |
CARLOMMAGNO, WILLIAM D.;CUMMINGS, DENNIS E.;GLIGA, ALEXANDRU S. |
分类号 |
H01L21/00;H01L21/603 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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