| 摘要 |
<p num="1"><br/><br/><br/><br/><br/> METHOD FOR PRODUCTION OF CERAMIC CIRCUIT BOARD<br/><br/><br/> ABSTRACT OF THE DISCLOSURE<br/><br/> A method for producing a ceramic circuit board<br/>comprising the steps of (i) forming a conductor portion<br/>of the ceramic circuit board by printing a conductive<br/>paste composition on a ceramic base plate for the<br/>circuit board and then (ii) firing the ceramic base<br/>plate and the conductive paste composition together,<br/>wherein a copper-base composition comprising a copper<br/>powder and 0.5 to 5 parts by weight, based on 100 parts<br/>by weight of copper powder, of at least one organo<br/>metallic compound capable of forming an inorganic<br/>compound or compounds, respectively, when fired in an<br/>inert atmosphere, is used as the conductive paste<br/>composition.<br/> The combined use of isopropyl tridodecylbenzene<br/>sulfonyl titanate and isopropyl triisostearoyl titanate<br/>greatly improve the flowability of the copper-base<br/>conductive paste composition.<br/> |
