发明名称 |
Apparatus for holding plates |
摘要 |
The apparatus comprises a first holding member having a flat surface which is brought into contact with the nonprocess surface of the semiconductor wafer, a pair of second holding members having inclined surfaces which are spaced apart from said flat surface by a predetermined distance, and cooperate with the flat surface to receive the arcuated edge of the semiconductor wafer. The second holding members are spaced apart from each other in a direction perpendicular to a semiconductor wafer insertion direction. The inclined surfaces being inclined such that a distance between the inclined surfaces and the flat surface is decreased in the semiconductor wafer insertion direction, thereby clamping the arcuated edge portions of the semiconductor wafer.
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申请公布号 |
US4955649(A) |
申请公布日期 |
1990.09.11 |
申请号 |
US19890312603 |
申请日期 |
1989.02.21 |
申请人 |
TEL SAGAMI LIMITED |
发明人 |
ISHII, KATSUMI;SASAKI, YASUSHI |
分类号 |
B25B9/00;B25B11/00;H01L21/687 |
主分类号 |
B25B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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