Plasma conditioning of a substrate for electroless plating
摘要
A dielectric surface is conditioned for electroless plating of a conductive metal thereon by exposing the substrate to a gaseous plasma obtained from ammonia and/or an organic amine. The conditioning can be in the holes and/or on the surfaces of the substrate.
申请公布号
US4956197(A)
申请公布日期
1990.09.11
申请号
US19880253321
申请日期
1988.09.30
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
BABU, SURYADEVARA V.;LU, NENG-HSING;JONES, GERALD W.