发明名称 MANUFACTURE OF MULTILAYER INTERCONNECTION SUBSTRATE
摘要 PURPOSE:To achieve throughout automation from a designing stage to a manufacturing stage without requiring many kinds of press molds or printing masks by cutting a substrate material, on which a wiring pattern with specified shape is formed by a printing means using printing material containing an electrically conductive material, and superposing a plurality of cut parts. CONSTITUTION:A through hole is formed at a specified position of a flexible substrate material 1 (2), and a wiring pattern with specified shape is formed on the surface of the substrate material 1 and the through hole by a printing means using printing material containing an electrically conductive material (3). Then the substrate material is cut, and a plurality of the cut parts are superposed and cut and laminated (4). Thus, many kinds of press molds or printing masks are made unnecessary and the wiring pattern can be printed automatically by pattern data, and an automation line for manufacturing can be realized.
申请公布号 JPH02228095(A) 申请公布日期 1990.09.11
申请号 JP19890048864 申请日期 1989.02.28
申请人 NEC CORP 发明人 YANO TAKESHI;SHIMADA YUZO;TERAO HIROSHI
分类号 H05K3/46 主分类号 H05K3/46
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