| 摘要 |
PURPOSE:To facilitate the design of the chip mounting constitution of a multichip package by a method wherein chips, which respectively corprise an internal logical circuit and respectively have no input/output buffer, and chips, which respectively have an input/output buffer only, are respectively packaged as a different chip. CONSTITUTION:When a plurality of chips are packaged in one piece of a package and a multichip package is constituted, chips 1a and 1b, each comprising a peripheral input/output buffer part, and chip parts 2a to 2d, each comprising a peripheral input/output buffer part only, are housed in a cavity part 3 of the multichip package. Moreover, a wiring 4 between the chips 1a and 1b is connected to the package without the medium of the peripheral input/output buffer parts and signal conductors 5 only, which are connected to terminals of the package, are connected to the package through the chips 2a, 2b, 2c and 2d, each comprising a peripheral input/output buffer part. This way is applied as a constitution that the optimum product process necessary for the individual chips can be freely selected and the design of the multichip package is facilitated. |
