| 摘要 |
<p>PURPOSE:To reduce a reflection loss and to hold the good high-frequency characteristics of the title component by a method wherein signal wirings and grounding wirings are formed into a coplanar structure and the gaps between the signal and grounding wirings are set in a prescribed state in regions, which correspond to a hermetic sealing part, of the signal and grounding wirings. CONSTITUTION:Signal wirings 4 and grounding wirings 5, which are formed on the other surface of an insulating substrate 1, are formed into a coplanar type wiring structure, a cap body 8 (ceramic cylindrical bodies 8a and a sealing metallic plate 8b), which crosses these wirings and comes into contact opposingly with opening ends dielectrically on the surface of the substrate 1 to seal hermetically a semiconductor integrated circuit chip 3, is installed and a high-speed digital integrated circuit component is constituted. Moreover, the width of the wirings 15 adjacent to the wirings 4 is made narrow in regions, which correspond to a hermetic sealing part, of the wirings 4 and 5 and the gaps between the wirings 4 and 5 are made wide in these regions. Thereby, a necessary impedance matching is obtained.</p> |
