HYOMENJITSUSOGATAICNINAIZAISURUSUIBUNNOHAISHUTSUHOHO

摘要

A plastic-sealed IC device comprises an IC lead frame having a chip mounting area, an IC chip fixedly mounted on the IC lead frame in the chip mounting frame area, and a plastic package molded so as to seal the IC lead frame therein. The plastic package has an opening formed so as to allow the backside of the chip mounting area to communicate with the atomonphere to discharge the moisture accumulating in the vicinity of the IC chip.