THREE-DIMENSIONAL DEVICE

摘要

A memory IC (10a) comprises a substrate (transfer-side substrate) (21), and memory cell arrays (71, 72, 73) formed in multilayer on the substrate (21) in order of mention from the lower side of the Figure by thin-film structure transfer. In the thin-film structure transfer method, a thin-film device layer (memory cell array) is formed on a substrate through an isolation layer, the isolation layer is irradiated with illumination light, determination in the isolation layer and/or at the interface is caused to occur, and the thin-film device layer is transferred to the substrate (21).